AMD’s EPYC Genoa 9000 processors and accompanying SP5 socket with its heatsink have been photographed again. The next-gen EPYC lineup will offer a monstrous amount of performance under the hood with up to 96 cores and 400W TDPs, as stated in the specs leaked a few days ago.
AMD EPYC Genoa 9000 Processor with Zen 4 Cores and SP5 Socket with Heatsink Shown – Large, Hard, Ultra-Fast Server Chip
The AMD EPYC Genoa 9000 processors support new memory and capabilities. In the company’s most recent details, reports indicate that the SP5 platform will also introduce an all-new socket, with a whopping 6096 pins laid out in the LGA socket format. This processor will be AMD’s largest socket design, adding 2002 more pins than the current LGA 4094 socket set.
For AMD to access those 96 cores, the company needs to squeeze more cores into its EPYC Genoa CPU package. AMD will achieve this by incorporating up to 12 CCD sensors. Each CCD will offer eight cores based on the upcoming new Zen 4 architecture. This corresponds to the extended socket size and could witness a considerable processor interposer – much larger than current EPYC processors. The processor is said to feature a TDP of 320W which can be configured up to 400W.
AMD EPYC Milan Zen 3 vs EPYC Genoa Zen 4 Size Comparisons:
|Processor name||AMD EPYC Milano||AMD EPYC Genoa|
|Process node||TSMC 7nm||TSMC 5nm|
|Basic Architecture||Zen 3||Zen 4|
|Zen CCD array size||80mm2||72mm2|
|Zen IOD Matrix Size||416mm2||397mm2|
|Substrate area (package)||To be determined||5428mm2|
|Socket name||LGA 4094||LGA 6096|
|TDP of max.||450W||700W|
Photos of the socket have been seen online before, but the newer models feature a much higher resolution in the recent photo series. Similarly, we also see an image of the SP5 heatsink which will be secured with up to eight Torx screws.
Next-generation data center AMD EPYC Genoa processors will launch in Q4 2022 and are expected to be shown before rival Intel reveals mass production of its Xeon Sapphire Rapids. It is also reported that AMD and Intel processors have been made available to some customers for early deployment and testing.